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PF48F3P0ZB00 Datasheet (PDF) - Intel Corporation

PF48F3P0ZB00 Datasheet PDF - Intel Corporation
Part # PF48F3P0ZB00
Download  PF48F3P0ZB00 Download

File Size   1609.91 Kbytes
Page   102 Pages
Manufacturer  INTEL [Intel Corporation]
Direct Link  http://www.intel.com
Logo INTEL - Intel Corporation
Description Intel StrataFlash Embedded Memory

PF48F3P0ZB00 Datasheet (PDF)

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PF48F3P0ZB00 Datasheet PDF - Intel Corporation

Part # PF48F3P0ZB00
Download  PF48F3P0ZB00 Click to download

File Size   1609.91 Kbytes
Page   102 Pages
Manufacturer  INTEL [Intel Corporation]
Direct Link  http://www.intel.com
Logo INTEL - Intel Corporation
Description Intel StrataFlash Embedded Memory

PF48F3P0ZB00 Datasheet (HTML) - Intel Corporation

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PF48F3P0ZB00 Product details

Introduction
This document provides information about the Intel StrataFlash® Embedded Memory (P30) device and describes its features, operation, and specifications.

Product Features
■ High performance
    — 85/88 ns initial access
    — 40 MHz with zero wait states, 20 ns clock-to data output synchronous-burst read mode
    — 25 ns asynchronous-page read mode
    — 4-, 8-, 16-, and continuous-word burst mode
    — Buffered Enhanced Factory Programming (BEFP) at 5 µs/byte (Typ)
    — 1.8 V buffered programming at 7 µs/byte (Typ)
■ Architecture
    — Multi-Level Cell Technology: Highest Density at Lowest Cost
    — Asymmetrically-blocked architecture
    — Four 32-KByte parameter blocks: top or bottom configuration
    — 128-KByte main blocks
■ Voltage and Power
    —VCC(core) voltage: 1.7 V – 2.0 V
    —VCCQ (I/O) voltage: 1.7 V – 3.6 V
    — Standby current: 55 µA (Typ) for 256-Mbit
    — 4-Word synchronous read current: 13 mA (Typ) at 40 MHz
■ Quality and Reliability
    — Operating temperature: –40 °C to +85 °C
        • 1-Gbit in SCSP is –30 °C to +85 °C
    — Minimum 100,000 erase cycles per block
    — ETOX™ VIII process technology (130 nm)
■ Security
    — One-Time Programmable Registers:
        • 64 unique factory device identifier bits
        • 64 user-programmable OTP bits
        • Additional 2048 user-programmable OTP bits
    — Selectable OTP Space in Main Array:
        • 4x32KB parameter blocks + 3x128KB main blocks (top or bottom configuration)
    — Absolute write protection: VPP= VSS
    — Power-transition erase/program lockout
    — Individual zero-latency block locking
    — Individual block lock-down
■ Software
    — 20 µs (Typ) program suspend
    — 20 µs (Typ) erase suspend
    —Intel® Flash Data Integrator optimized
    — Basic Command Set and Extended Command Set compatible
    — Common Flash Interface capable
■ Density and Packaging
    — 64/128/256-Mbit densities in 56-Lead TSOP package
    — 64/128/256/512-Mbit densities in 64-Ball Intel®Easy BGA package
    — 64/128/256/512-Mbit and 1-Gbit densities in Intel®QUAD+ SCSP
    — 16-bit wide data bus




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About Intel Corporation


Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California.
It is one of the world's largest and highest valued semiconductor chip makers, based on revenue.
Intel is best known for its development of microprocessors, the central processing units (CPUs) of computers.
Founded in 1968, Intel has been a leader in the computer hardware industry for over five decades.
In addition to microprocessors, the company offers a wide range of products and technologies, including data center and network equipment, solid-state drives, internet of things (IoT) devices, and more.
Intel is also a leading player in the development of 5G networks and autonomous vehicles.
With a focus on innovation and technology leadership, Intel continues to play a significant role in shaping the future of computing and technology.
The company invests heavily in research and development and has been awarded over 17,000 patents for its innovations.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.




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