Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd. |
0879370802
|
102Kb / 3P |
2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 8 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
|
0879371206
|
102Kb / 3P |
2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 12 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
|
0879370406
|
102Kb / 3P |
2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 4 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
|
0879370502
|
102Kb / 3P |
2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 5 Circuits, 2.50關m (100關") Tin (Sn) Plating, 11.00mm (.433) Stacking Height
|
0879370106
|
102Kb / 3P |
2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 1 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
|
0877970040
|
196Kb / 4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row Dual Body, Vertical, 40 Circuits, 2.54關m (100關) Tin (Sn) Plating, 14.22mm (.560) Stacking Height
|
0879370801
|
194Kb / 4P |
2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 8 Circuits, 0.75關m (29關) Gold (Au) Plating, 10.90mm (.429) Stacking Height
|
0878910606
|
770Kb / 10P |
2.54mm (.100) Pitch KK짰 Header, Through Hole, Breakaway, Vertical, 6 Circuits, 2.50關m (100關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
0878910306
|
770Kb / 10P |
2.54mm (.100) Pitch KK짰 Header, Through Hole, Breakaway, Vertical, 3 Circuits, 2.50關m (100關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
0878914006
|
770Kb / 10P |
2.54mm (.100) Pitch KK짰 Header, Through Hole, Breakaway, Vertical, 40 Circuits, 2.50關m (100關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|