Manufacturer | Part # | Datasheet | Description |
Maxim Integrated Produc... |
21-0136F
|
55Kb / 2P |
PACKAGE OUTLINE 12,16L THIN QFN, 3x3x0.8mm
Rev F |
21-0141
|
104Kb / 2P |
PACKAGE OUTLINE, 36,40,48L THIN QFN, 6*6*0.75MM
Rev N |
21-0144
|
128Kb / 2P |
PACKAGE OUTLINE 32,44,48,56L THIN QFN, 7*7*0.75MM
REV .K |
21-0140
|
59Kb / 2P |
PACKAGE OUTLINE, 16,20,28,32,40L THIN QFN, 5*5*0.75MM
REV .Q |
Dallas Semiconductor |
21-0102
|
109Kb / 2P |
PACKAGE OUTLINE, 12,16L QFN, 3x3x0.90 MM
|
Fujitsu Component Limit... |
FPT-20P-M04
|
37Kb / 1P |
THIN SHRINK SMALL OUTLINE PACKAGE
|
National Semiconductor ... |
MKT-SLD20A
|
49Kb / 1P |
THIN CSP, PLASTIC, LAMINATED, 3.5 X 3.5 X 0.8mm BODY, 20L, 0.5mm PITCH
|
ACCUTEK MICROCIRCUIT CO... |
AK08D300-TSOP
|
545Kb / 5P |
Thin Small Outline Package TSOP DIP Adapters
|
P-tec Corporation |
PL00130-WCG25
|
32Kb / 1P |
Flat lens thin package 1.6 x 0.8 x 0.8mm
|
PL00130-WCA02
|
309Kb / 1P |
Flat lens thin package 1.6 x 0.8 x 0.8mm
|