Distinctive Characteristics Subminiature size saves space on PC boards. Specifically developed for logic-level applications. Totally sealed body construction prevents contact contamination and allows time- and money-saving automated soldering and cleaning. Award-winning STC contact mechanism with benefits unavailable in conventional mechanisms: smoother, positive detent actuation, increased contact stability and unparalleled logic-level reliability. (Additional STC details in Terms & Acronyms; see Supplement contents.) Molded-in, epoxy sealed or ultrasonically welded terminals lock out flux, solvents, and other contaminants. .100” x .100” (2.54mm x 2.54mm) terminal spacing conforms to standard PC board grid spacing. Toggle option in antistatic material available for dissipating electrostatic discharges. Matching indicators available and shown at the end of Section M.
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