| Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd. |
0015477754
|
388Kb/4P
|
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 54 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
0015477754
|
29Kb/2P
|
2.54mm Pitch C-Grid Header, Through Hole, Dual Row, Vertical, High Temperature
|
| Search Partnumber :
Start with "0015477754" -
Total : 48 ( 1/3 Page) |
Molex Electronics Ltd. |
0015477754
|
29Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole, Dual Row, Vertical, High Temperature
|
|
0015477750
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 50 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
0015477750
|
29Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole, Dual Row, Vertical, High Temperature
|
|
0015477752
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 52 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
0015477752
|
28Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole, Dual Row, Vertical, High Temperature
|
|
0015477756
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 56 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
0015477758
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 58 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
0015477706
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
0015477706
|
29Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole, Dual Row, Vertical, High Temperature
|
|
0015477708
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 8 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
0015477710
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 10 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
0015477712
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
0015477714
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 14 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
0015477716
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 16 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
0015477718
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 18 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
0015477718
|
28Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole, Dual Row, Vertical, High Temperature
|
|
0015477720
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 20 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
0015477720
|
28Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole, Dual Row, Vertical, High Temperature
|
|
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