Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd. |
0713085468
|
1Mb/8P
|
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 68 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
Search Partnumber :
Start with "0713085468" -
Total : 38 ( 1/2 Page) |
Molex Electronics Ltd. |
0713085460
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header
|
0713085462
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 62 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
0713085464
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 64 Circuits,1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator Pegs
|
0713085466
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 66 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
0713085404
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 4 Circuits,1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator Pegs
|
0713085406
|
1Mb/5P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Daughterboard Power Module, RightAngle, SMC, 3-Blade Module, 3 Circuits
|
0713085408
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 1.50um (59u") Minimum
|
0713085410
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 10 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
0713085412
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 12 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
0713085414
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
0713085416
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 16 Circuits,1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
0713085418
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 18 Circuits
|
0713085420
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 20 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
0713085422
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 22 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
0713085424
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 24 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
0713085426
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 26 Circuits,1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
0713085428
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 28 Circuits, 1.50um (59u") Minimum
|
0713085430
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 30 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
0713085432
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 32 Circuits, 1.50um (59u") Minimum
|