0879331217 Datasheet, PDF

Manufacturer	Part #	Datasheet	Description
Molex Electronics Ltd.	0879331217	355Kb/7P	1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 100 Circuits, 0.76關m (30關) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120), with Cap
Search Partnumber : Start with "0879331217" - Total : 19 ( 1/1 Page)
Molex Electronics Ltd.	0879331211	355Kb/7P	1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 100 Circuits, 0.38關m (15關) Gold (Au) Plating, Mating Pin Length 1.65mm (0.065), with Cap
	0879331215	355Kb/7P	1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 100 Circuits, 0.05關m (2關) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120), with Cap
	0879331007	355Kb/7P	1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 10 Circuits, 0.05關m (2關) Gold (Au) Plating, Mating Pin Length 1.65mm (0.065), with Cap
	0879333015	355Kb/7P	1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 30 Circuits, 0.05關m (2關) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120), with Cap
	0879335031	174Kb/4P	1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 50 Circuits, 0.38關m (15關) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120)
	0879370106	102Kb/3P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 1 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
	0879370406	102Kb/3P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 4 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
	0879370502	102Kb/3P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 5 Circuits, 2.50關m (100關") Tin (Sn) Plating, 11.00mm (.433) Stacking Height
	0879370600	194Kb/4P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 6 Circuits, 0.75關m (29關) Gold (Au) Plating, 10.90mm (.429) Stacking Height
	0879370800	194Kb/4P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 8 Circuits, 2.50關m (100關) Tin (Sn) Plating, 12.00mm (.472) Stacking Height
	0879370801	194Kb/4P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 8 Circuits, 0.75關m (29關) Gold (Au) Plating, 10.90mm (.429) Stacking Height
	0879370802	102Kb/3P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 8 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
	0879371206	102Kb/3P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 12 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
	0879371600	195Kb/4P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 16 Circuits, 0.25關m (10關) Gold(Au) Selective Plating, 17.63mm (.694) Stacking Height
	0879371601	195Kb/4P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 16 Circuits, 0.25關m (10關) Gold(Au) Selective Plating, 19.05mm (.750) Stacking Height
	0879380002	163Kb/4P	2.54mm (.100) Pitch KK짰 Header, Surface Mount, Single Row Dual Body, Vertical, 8 Circuits, Gold (Au) Selective Plating, 8.07mm (.318) Stacking Height
	0879390001	103Kb/3P	2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 16 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
	0879392000	333Kb/6P	2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 20 Circuits, 2.50關m (100關) Tin (Sn) Plating, 15.35mm(.604) Stacking Height
	0879394001	334Kb/6P	2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 40 Circuits, 0.75關m (30關) Gold (Au) Selective Plating, 6.40mm(.251)

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