Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd. |
0015800201
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
0015800203
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
|
0015800203
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical,
|
0015800205
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
0015800205
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical,
|
0015800207
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating
|
0015800207
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical,
|
0015800209
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
|
0015800209
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical,
|
0015800221
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, Tin (Sn) Plating
|
0015800221
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row
|
0015800223
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.38關m (15關) Gold (Au) Selective Plating,
|
0015800223
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
0015800225
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
0015800225
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
0015800229
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
|
0015800229
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical,
|
0015800241
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating
|
0015800241
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
0015800243
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits
|
|