Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd. |
0015800683
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
|
0015800685
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
0015800601
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 60 Circuits, Tin (Sn) Plating
|
0015800603
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 60 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
|
0015800605
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 60 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
0015800621
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, Tin (Sn) Plating
|
0015800623
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
|
0015800625
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
0015800641
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits, Tin (Sn) Plating
|
0015800643
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits
|
0015800645
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
0015800661
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, Tin (Sn) Plating
|
0015800663
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
|
0015800665
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
0015800061
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
0015800061
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
0015800063
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
|
0015800063
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
0015800065
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
0015800065
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
|