Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd. |
15-47-7732
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
15-47-7732
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
15-47-7732
|
35Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
15-47-7734
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 34 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
15-47-7734
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
15-47-7734
|
35Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
15-47-7736
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
15-47-7736
|
35Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
15-47-7736
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 36 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
15-47-7738
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
15-47-7738
|
35Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
15-47-7738
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 38 Circuits
|
15-47-7706
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
15-47-7706
|
35Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
15-47-7706
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
15-47-7708
|
35Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
15-47-7708
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
15-47-7708
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 8 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
15-47-7710
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 10 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
15-47-7710
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|