| Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd. |
70567-0151
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
70567-0151
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits
|
|
70567-0153
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.76關m (30關") Gold (Au) Selective Plating
|
|
70567-0153
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
70567-0154
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
70567-0154
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
70567-0155
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
70567-0155
|
51Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
70567-0156
|
51Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
70567-0156
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, 0.76關m (30關") Gold (Au) Selective Plating
|
|
70567-0159
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
70567-0159
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
70567-0120
|
1Mb/7P |
2.54mm (.100") Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 40 Circuits, Tin (Sn) Plating
|
|
70567-0125
|
1Mb/7P |
2.54mm (.100") Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 50 Circuits, Tin (Sn) Plating
|
|
70567-0131
|
1Mb/7P |
2.54mm (.100") Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 62 Circuits, Tin (Sn) Plating
|
|
70567-0137
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
70567-0137
|
51Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,
|
|
70567-0138
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
70567-0138
|
46Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,
|
|
70567-0139
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
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