| Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd. |
71308-5452
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 52 Circuits, 1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator Pegs
|
|
71308-5454
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 54 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
|
71308-5456
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 56 Circuits,1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
|
71308-5458
|
1Mb/8P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 58 Circuits, 1.50關m (59關) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating
|
|
71308-5404
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 4 Circuits,1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator Pegs
|
|
71308-5406
|
1Mb/5P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Daughterboard Power Module, RightAngle, SMC, 3-Blade Module, 3 Circuits
|
|
71308-5408
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 1.50um (59u") Minimum
|
|
71308-5410
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 10 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
|
71308-5412
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 12 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
|
71308-5414
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
|
71308-5416
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 16 Circuits,1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
|
71308-5418
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 18 Circuits
|
|
71308-5420
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 20 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
|
71308-5422
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 22 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
|
71308-5424
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 24 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
|
71308-5426
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 26 Circuits,1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
|
71308-5428
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 28 Circuits, 1.50um (59u") Minimum
|
|
71308-5430
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 30 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
|
71308-5432
|
1Mb/8P |
2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 32 Circuits, 1.50um (59u") Minimum
|
|
71308-5434
|
1Mb/5P |
2.54mm (.100") Pitch C-Grid짰 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 94 Circuits, 8.13mm (.320") Mating Pin Length, 0.76關m (30關") Gold (Au) Selective
|
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