| Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd. |
A-70568-0080
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 28 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
A-70568-0080
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
A-70568-0080
|
35Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
|
A-70568-0081
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 30 Circuits
|
|
A-70568-0081
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
A-70568-0081
|
35Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
|
A-70568-0082
|
35Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
|
A-70568-0082
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
A-70568-0082
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
A-70568-0083
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 34 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
A-70568-0083
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
A-70568-0083
|
35Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
|
A-70568-0085
|
35Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
|
A-70568-0085
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
A-70568-0085
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 38 Circuits
|
|
A-70568-0086
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 40 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
A-70568-0086
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
A-70568-0086
|
35Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
|
A-70568-0087
|
35Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
|
A-70568-0087
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
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