| Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd. |
A-70568-0130
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
A-70568-0131
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
A-70568-0132
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
A-70568-0133
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
A-70568-0134
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
A-70568-0136
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
A-70568-0137
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
A-70568-0138
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
A-70568-0139
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
A-70568-0100
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 68 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
A-70568-0100
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
A-70568-0100
|
47Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
|
A-70568-0101
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 70 Circuits, 0.76關m (30關) Gold (Au) Selective
|
|
A-70568-0101
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
A-70568-0101
|
35Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
|
A-70568-0102
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 72 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
A-70568-0102
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
A-70568-0102
|
35Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
|
A-70568-0103
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
A-70568-0104
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
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