Manufacturer | Part # | Datasheet | Description |
OKI electronic componet... |
RFP-QD10
|
267Kb/6P |
Soldering and Rework System
|
RFP-QD15
|
267Kb/6P |
Soldering and Rework System
|
RFP-QD20
|
267Kb/6P |
Soldering and Rework System
|
RFP-QD4
|
267Kb/6P |
Soldering and Rework System
|
RFP-QD6
|
267Kb/6P |
Soldering and Rework System
|
RFP-QD7
|
267Kb/6P |
Soldering and Rework System
|
Anaren Microwave |
RFP-050060-15X50-2
|
498Kb/2P |
Chip Terminations 4 Watts, 50ohm
|
RFP-050100-1X50-2
|
498Kb/2P |
Chip Terminations 5 Watts, 50ohm
|
RFP-050100-2X50-2
|
496Kb/2P |
Chip Terminations
|
RFP-050100-2X50-2
|
232Kb/2P |
Chip Termination 5 Watts, 50ohm
|
RFP-050100-2X50-2
|
232Kb/2P |
Chip Termination 5 Watts, 50ohm
|
RFP-060120A15Z50
|
519Kb/2P |
Alumina Terminations 8 Watts 50ohm
|
NXP Semiconductors |
RFP-060120A15Z50-2
|
576Kb/18P |
RF LDMOS Wideband Integrated Power Amplifiers
Rev. 0, 10/2009 |
RFP-060120A15Z50-2
|
393Kb/18P |
RF LDMOS Wideband Integrated Power Amplifiers
Rev. 0, 11/2009 |
Freescale Semiconductor... |
RFP-06012A15Z50
|
722Kb/17P |
RF LDMOS Wideband Integrated Power Amplifiers
|
NXP Semiconductors |
RFP-06012A15Z50
|
784Kb/17P |
RF LDMOS Wideband Integrated Power Amplifiers
Rev. 0, 5/2012 |
RFHIC |
RFP-0850-27-27PS
|
393Kb/3P |
HPA Module
|
RFP-0850-33-27
|
458Kb/4P |
HPA Module
|
RFP-0880-42-27
|
652Kb/3P |
HPA Module
|
RFP-0881-45-27
|
482Kb/4P |
HPA Module
|